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Bostik further extends Born2Bond range for electronics manufacturing

Bostik further extends Born2Bond range for electronics manufacturing

Bostik has extended its Born2Bond engineering adhesive range designed to support the electronics manufacturing sector in the assembling, waterproofing, dustproofing and serviceability of miniaturised electronics such as wearables and handheld devices and larger applications such as smart meters and LED lights.

The new versatile and single-component High Performance HMPUR (Hotmelt Polyurethane Reactive) range has been designed specifically for the manufacture of miniaturised handheld and wearable electronic devices such as mobile phones, smart watches and headphones. High Performance HMPUR products are available with a range of viscosities and open times to suit different applications and assembly processes.

Born2Bond High Performance HMPUR adhesives are said to deliver excellent bonding performance (both rigid and elastic) and to be capable of withstanding fluctuations in temperature and humidity, as well as being resistant to impact and chemical or organic compounds such as sweat or sebum.

Born2Bond's new UV-CIPG (UV Cure-in-place Gasket) range provides single-component, precise gasketing solutions with typically 0.5-2mm high gaskets for waterproofing, dustproofing and serviceability of mobile phones, tablets, smart watches, digital cameras, and automotive applications such as battery management systems (BMS), electronic control units (ECU) and advanced driver-assistance systems (ADAS). The adhesives are said to offer excellent adhesion to a variety of substrates including plastic, glass and metal – and provide an effective and cost-efficient solution to cut or moulded gaskets that are typically assembled by hand with significant labour costs and carry a high risk of defect. Bostik says they also eliminate the need for investment in expensive and space-consuming equipment such as moulds and ovens.

Bostik says the UV-CIPG range delivers a flexible and robust result that does not crack even when compressed or deformed, and which can withstand exposure to temperature fluctuations and chemicals. With high thixotropic indexes, the products provide a consistent bead aspect ratio and can be rapidly and precisely dispensed using automatic dispensing equipment.

For larger applications such as smart meters and LED lights where 2-5mm-high gaskets are required for dust and water proofing, Bostik’s UV-FG (UV Foam Gasket) range provides a fast-curing alternative to moulded gaskets that can easily be integrated into manufacturing lines. Its single-component design means mixing is not required and a high-foam expansion enhances resilience during the assembly process.

 
Bostik Findley (Evode)

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