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Camera upgrade for Micro system

Camera upgrade for Micro system

The latest version of the Micro thermal imaging system from OptoTherm for semiconductor failure analysis includes a new thermal imaging camera with 320x240 element uncooled detector and 0.05degC sensitivity, 20micro m microscopic lens, wide angle lens, and 16-bit digital Camera Link interface.

As electronic devices continue to decrease in size, heat generation and thermal dissipation become increasingly important. Micro can measure and display the temperature distribution over the surface of semiconductor devices, enabling quick detection of hot areas which can decrease efficiency and frequently lead to early failure.  Additional applications include calculating thermal resistance, measuring junction temperature, and identifying die bond defects. A complete Micro system includes thermal imaging camera, tower computer and monitor, mounting platform, vertical camera stage, XY table, thermal chuck with controller, and I/O relay module.

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