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Virtual Panel Event about Industrial Connectivity

Virtual event

17/05/2021(16:00-17:00)

This 60-minute virtual panel discussion between industry experts will explore the intersection of connectivity (more)

UKIVA Machine Vision Conference

Virtual

15/07/2021

Join us on 15 July 2021 on the MVC Technology Presentation Hub and explore eight online seminar theatres. (more)

PPMA Show 2021

NEC, Birmingham(B40 1NT)

28/09/2021 - 30/09/2021

PPMA Show 2021 will be the UK’s largest ever event dedicated to state-of-the-art processing and (more)

Southern Manufacturing

Farnborough, Hants(GU14 6TQ)

06/10/2021 - 07/10/2021

Southern Manufacturing and Electronics is the most comprehensive annual industrial exhibition in the (more)

Advanced Engineering 2021

NEC Birmingham(B40 1NT)

03/11/2021 - 04/11/2021

Join us in our 12th and most important edition to date, as we invite engineers and management from all (more)

High-tech adhesives for the photovoltaic industry

High-tech adhesives for the photovoltaic industry
Extremely productive manufacturing processes and new concepts for saving materials and energy are vital to the future viability of the solar industry. To meet the challenges facing the market, Henkel develops innovative adhesives and sealants. At the 25th European Photovoltaic Solar Energy Conference in Valencia, the company will be presenting powerful solutions spanning the entire value chain. 

The photovoltaic industry will soon be taking a development leap in wafer production. Conventionally, wafers are rapidly and precisely sliced out of silicon ingots with a wire saw. The entire ingot is bonded to a glass plate and the workpiece holder to ensure reliable processing. After the slicing process, the edges of the wafers are still fixed to the glass plate via the adhesive and the two parts then have to be disbonded through the application of acetic acid at high temperatures. 

Under its Loctite brand, Henkel has developed a new two-component epoxy adhesive which cures ultra-fast, resulting in high-strength and extremely reliable bonding even of extremely thin wafer edges. The new technology also offers the unique advantage that the adhesive can be removed easily and without residues during the following cleaning process, simply with water at a temperature of approx. 60°C. Acetic acid, which causes problems due to its corrosivity, is thus no longer necessary to disbond the wafer from the glass plate.
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