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Advanced Engineering 2020

NEC, Birmingham(B40 1NT)

04/11/2020 - 05/11/2020

The UK's largest annual advanced manufacturing trade show, Advanced Engineering is your opportunity to (more)

Drives & Controls Exhibition

NEC, Birmingham(B40 1NT)

25/01/2021 - 27/01/2021

The show brings together key suppliers of state-of-the-art equipment representing the multi-tasking culture (more)

No-drip solder paste formulation

No-drip solder paste formulation
EFD has introduced a new no-drip, SAC305 solder paste dispensing formulation for mechanical soldering. This lead-free, no-clean formulation is excellent for gap filling and application on vertical surfaces. 

The new formulation was created to help customers solder a perfect joint around a heat tube (or heat sink) container. Research found that competitors' formulations would drip down the container during the reflow process and create an insufficient solder joint.

In contrast, EFD's no-drip formulation wets well and wicks around many metal surfaces like silver, silver-plated, nickel, brass, and copper to produce perfect solder joints.

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