Diary and Events
NEC Birmingham(B40 1NT)
25/09/2019 - 26/09/2019
Sensors & Instrumentation Live will celebrate its 10 year anniversary in 2019 and the UK’s (more)
NEC, Birmingham(B40 1NT)
01/10/2019 - 03/10/2019
The UK’s largest ever event in the processing and packaging sector calendar. With over 350 exhibitors (more)
Sick launches next-generation ultrasonic fork sensorsTransparent labels and substrates pose no problems for the new SICK UF Next fork sensor which uses ultrasonics to sense label position precisely whether clear, opaque, with coloured or printed designs, different web materials or even foils and metallics. The versatility of the improved design is matched by a fast response time to ensure accuracy even at high web speeds, making it ideal for a wide range of packaging and labelling applications.
"The UF Next solves a host of problems encountered in labelling," explains Phil Dyas, Sensor Expert SICK UK. "It will even detect double sheets, overlaps and two ply materials. The ultrasonic technology overcomes the false signals picked up by optical sensors and this model is unaffected by temperature changes, so you really only need one sensor to cover all label types."
The SICK UF Next fork sensor has a compact and rugged IP 65 aluminium housing, allowing it to be located in tight spaces and withstand difficult industrial conditions.
With a minimum detection space between labels of 2 mm and a stable response time of 250 µsec, the SICK UF Next is ideal for long run, high speed labelling operations. Quick set up is achieved via the dynamic teach-in, using either a control panel or remote wire, with manual fine tuning by the +/- buttons on the housing.
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