Beckhoff UK will exhibit at MACH 2026 at the NEC, Birmingham from April 20-24, 2026, demonstrating its MX-System alongside XTS and a two-tile XPlanar system.

The process and packaging industry is changing, and developments such as digitalisation, increasing regulatory requirements and changing consumer behaviour are challenging producers, machine builders and system integrators. COPA-DATA will be presenting its zenon software platform at interpack, demonstrating how process automation supports transformation within the industry.

The Machinery Regulation may be mandatory from January 2027, but the subjects it covers - such as external attacks and potential manipulation - are issues that we're all facing right now. Knowledge is power; take your Industrial Security to the next level with the experts at Pilz.

LED Analyzers from Micro-Epsilon are being used as part of end-of-line test equipment to measure the colour and intensity of red and green status LEDs for charging stations designed for aircraft cabin applications.

Farnell has signed a new distribution agreement with Hongfa, a leading manufacturer of relays and electromechanical components. The agreement comes as demand for high-performance, reliable relay solutions continues to grow across industrial automation, automotive, energy, and smart building applications.

In the modern factory environment, designing automated intralogistics is no longer just a race for speed and density. For Italian OEM Metalprogetti, the priority shifted toward ensuring that complex, high-throughput machinery can operate safely without sacrificing performance or operational flexibility. ReeR Safety was able to help.

Physik Instrumente (PI) has been named the Gold winner in the 2026 Team Massachusetts Economic Impact Awards, presented by MassEcon. The awards recognise companies making significant contributions to the state's economy.

Energy efficiency has become a board‑level margin and risk issue, but many industrial organisations are struggling to turn intent into sustained results, according to a new report from ABB.

When Rotech Systems and Encoders' potting compound was discontinued, it exposed a deeper issue: unreliable supply was already limiting production growth. Unable to forecast deliveries or secure consistent stock, Rotech could not commit to increasing output. By implementing a structured supply model with encapsulant expert Intertronics, the company removed that bottleneck and expanded annual production from 1,500 to 4,000 units.

Automation solutions provider Eberle Automatische Systeme has developed a breakthrough in quality control with a focus on the cheese-ripening process, combining AI with machine vision software from MVTec.