When the front fender for the eWolf electric tugboat needed to be bonded using a strong adhesive that would withstand pushing and pulling forces during the process of adhering the fender to the eTug, the manufacturer turned to Belzona.

New from SPIROL is the Series CL6000 range of lightweight, lead-free, aluminium precision machined compression limiters. The CL6000 is machined from 2024 grade aluminium which provides the best combination of strength, corrosion resistance, machineability and cost.

Henkel Adhesive Technologies, through its LOCTITE brand, has formed a close partnership with the TAG Heuer Porsche Formula E Team. And it is maintaining that partnership through the 2024 Formula E World Champtionship.

PennEngineering has announced today the acquisition of Sherex Fastening Solutions, a global leader in the design, manufacturing, and installation of blind rivet nuts and associated fastening solutions.

The highly experienced people at FDB Panel Fittings Online store have suggested that with so much ordering now taking place quickly and conveniently over the internet a reminder regarding IP ratings would be appropriate.

To make it even easier for manufacturing and design engineers to order adhesives, equipment, and consumables, Intertronics has launched an online shop.

For electronics and medical device manufacturers who need to dispense small volumes of liquid with high precision and accuracy, the preeflow eco-PEN XS 180 from Intertronics enables the volumetric dispensing of 0.25 µl quantities.

Kevin Brownsill, head of technical: learning and development at adhesives specialist Intertronics, shares guidance on bonding specialist medical plastics.

Using the newly available Welducation Simulator from Fronius, welders can learn, train and consolidate their welding skills step-by-step under realistic conditions without any risk to safety and with no additional costs for materials, gases, or wear parts.

Paul Whitehead, strategic accounts manager at Intertronics, explains how manufacturers can avoid the introduction of voids during the processing of potting compounds.