Posted to News on 2nd Jan 2006, 00:00
Multi-level evaporation masks are robust and accurate
High-performance evaporation masks, for use across a wide range of selective vacuum chamber processes, have been further enhanced, by leading provider Tecan - combining coplanar rigidity with optimum aperture accuracy.
Using Photo ElectroForming (PEF) and photo-etching techniques, the company produces cost-effective nickel and stainless steel masks which out-perform traditional alternatives. The technique combines low tooling costs with superior tolerances, delivering greater density designs with higher accuracy aperture edges.
Multi-level masks can also be produced, with 'stepped' recesses, limiting the need for spacer sheets in multiple-sheet sets, if required. Similarly, multi-level masks can be produced with the thinnest possible cross-section where apertures occur, to virtually eliminate photo-shadow and optimise process accuracy. The technology also allows selective areas across the mask to remain thicker - assuring coplanarity and operational robustness.
