Emerson will exhibit its latest Floor to Cloud packaging solutions at PACK EXPO Chicago. Advancing the boundless future of automation, Emerson factory automation solutions and its Floor to Cloud approach empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.

New research by ABB, in collaboration with Sapio Research, has surveyed nearly 2,400 global businesses to gain insight into the state of the market around energy efficiency, sustainability, digitalisation, and the key role played by electric motors.

Three large, travelling-column bed mills at the Swansea factory of subcontractor Afon Engineering have been retrofitted with a Heidenhain TNC 320 control and new drives to improve their reliability and performance.

TDK-Lambda will present and demonstrate its latest innovations in power supply technology at electronica 2024. Visitors will experience cutting-edge power supply solutions that deliver industry-leading performance across a wide range of applications.

Visitors to SPS 2024 will have the chance to experience user-friendly production measurement technology for every process step: at the SPS 2024, Kistler will showcase its customisable solutions for process monitoring and quality assurance in demanding industrial production applications.

In times of great challenges, it is crucial for machine manufacturers to strengthen their resilience and develop new competitive advantages. At SPS in Nuremberg, Lenze will be showcasing solutions that OEMs can use to sustainably increase their productivity and efficiency despite a lack of resources, IT expertise, high costs and pressure to innovate.

Rubix has obtained an EcoVadis gold medal for the third year in a row. This reflects the company's continuing progress on environmental, social and governance (ESG) topics.

Kontron and IdeaNova Technologies, a leader in IFE software and secure video streaming, have announced a partnership that delivers a fully integrated inflight entertainment system with seamless connectivity, secure high-speed streaming and diverse entertainment options, setting new standards for in-flight experiences.

Siemens Digital Industries Software reports that SEDEMAC has adopted the Siemens Xcelerator portfolio of industry software to help it innovate and accelerate product development while not compromising on quality within its Research and Development, Engineering and Manufacturing teams.

In a secondary packaging operation, bags of products like confectionery are often 'shingled', a process of layering them into a cardboard shipping box in alternating overlapped layers. Photoelectric sensors with background-suppression from Contrinex have provided a reliable means of checking the correct quantity of bags in each box.