Posted to News on 23rd Jun 2025, 13:30
Emerson to Present Intelligent Automation Solutions at Automatica 2025
Emerson will demonstrate how it's transforming the future of industrial manufacturing and automation through the proven Floor to Cloud approach and its comprehensive solutions portfolio at the automatica trade fair in Munich.
Visitors to the Emerson booth will learn how companies of any size can apply a Floor to Cloud approach to drive sustainable growth, maximise performance quality and unleash workforce productivity for immediate and long-term success.
Located in the Hall A5 assembly and handling area, booth 514 will feature immersive demonstrations and displays. This interactive hub will showcase how products from the Emerson portfolio, including Afag, Movicon, PACEdge and PACSystems brands, combine to form intelligent solutions that transform operations across the factory floor and deliver ongoing value.
Live demonstrations in the Emerson booth will focus on ways the solution provider can help companies leverage advanced automation and data-driven operations to boost manufacturing performance, achieve carbon-neutral manufacturing and maximise worker potential. Exhibits include:
A plug-and-play bowl feeding solution, which leverages standardised, flexible, high-precision components to boost accuracy, speed and reliability of small and micro part feeding applications. Whether in high-volume production, cleanroom environments or handling complex geometries, this adaptable, intelligent part feeding and sorting system lets manufacturers maximise operational efficiency and throughput.
A global dashboard display, which helps companies unlock the power of their operations with seamless data integration. By connecting machine by machine and factory by factory, manufacturers can compare performance and energy consumption, apply benchmarks and drive continuous improvement.
A high-speed, electric pick and place system, which demonstrates how manufacturers can improve the precision and performance of this common production line application. The system can significantly reduce energy use and maintenance costs while increasing throughput.
An automated ballpoint pen assembly solution, which showcases how the full range of Emerson technologies can work together in a seamlessly integrated system to assemble a product. The Floor to Cloud solution combines hardware components and devices with advanced software to provide detailed handling data, such as per-product energy consumption.
