Optimised size, weight and power with high-performance thermal imaging

The state-of-the-art 8-micron pixel is said to enable industry-best thermal performance and four times the resolution of today's high-volume, uncooled VGA (640 512) thermal camera modules, all within a similarly sized compact package.

Designed for high-performance and optimised for size, weight, and power (SWaP) constrained defence and industrial applications, the Boson SX8 family enables integrators and operators to see more, see farther, and deploy high-performance thermal imaging at production scale.

Critical for uncrewed aircraft systems (UAS), counter-UAS, perimeter security, handheld devices, seekers, visual augmentation, and intelligence, surveillance, and reconnaissance (ISR) systems, the Boson SX8 family delivers performance previously available only in heavier, larger, and more power-hungry cooled, midwave infrared (MWIR) thermal imaging systems.

"By reducing pixel area by 55% compared to the standard 12-micron LWIR pixel format, Boson SX8 represents a transformational moment for thermal imaging," said Paul Clayton, President, Teledyne FLIR OEM. "By pairing this advanced 8-micron pixel architecture with SXGA thermal resolution at full-rate production, we're giving customers greater situational awareness and longer effective range without compromising SWaP or supply-chain confidence."

In addition to multiple fixed-lens options, the new Boson SX8-CZ 15-75 features a factory-integrated 5x continuous-zoom (CZ) lens to further extend range performance. This option pairs the camera module with a 15-75 mm continuous-zoom lens, engineered and calibrated as a single system. The integration provides optimised optical performance with focus-through-zoom, thermal gradient compensation, factory alignment, and a single-source warranty, reducing integration risk while accelerating time to market.