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Tough conductive adhesive withstands severe conditions

Master Bond EP11SIC is a cost effective, silver-filled epoxy-resin system featuring exceptionally high electrical and thermal conductivity. It offers the application convenience of a one component system in addition to flexible cure schedules so as to best meet specific processing requirements.

It has superior adhesion to both metallic and non-metallic substrates with a tensile strength greater than 6,000psi and a tensile shear strength over 1,500psi. EP11SIC is very tough for a filled system and features good resistance to thermal shock, high temperatures and chemicals.

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