Server-class performance with PCIe Gen4 and 10 Gbit connectivity

Kontron is expanding its extensive Computer-on-Modules portfolio with  the COM Express basic type 7 module COMe-bID7 featuring Intel Xeon D-1700 processors (former codename Ice Lake D). In addition, Kontron also introduces a new COM Express type 7 evaluation carrier.

The COMe-bID7 with scalability from 4 to 10 cores on a small form factor and SKUs for industrial temperature range of -40°C up to +85° as well as 24x7 / 10 years reliability allows robust, space-constraint implementations in harsh environments and extreme conditions.

The module accommodates up to 4x SO-DIMM sockets for a max. of 128GB memory. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.

16x PCIe Gen4 plus 16x PCIe Gen3 lanes and 4x 10GBASE-KR interfaces provide an ideal support for high data throughput requirements in demanding I/O and network structures.

The 10GBASE-KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) – on the base board.

Complemented by real-time capabilities such as low latency and determinism with Intel Time Coordinated Computing (TCC) and Time Sensitive Network (TSN), the platform is highly suitable for the usage in high-performance IoT edge computing.

“The Computer-on-Module design targets applications in embedded IoT for Industry 4.0, use cases such as test and measurement, autonomous vehicles and robotics as well as numerous potential applications of AI workloads. Applications in the network edge include use cases such as multi-access edge computing (MEC) or 5G RAN”, says Peter Müller, VP of product center modules.

The Kontron COMe Eval Carrier T7-Gen2 offers a complete set of standard interfaces and the freedom of choice regarding the according Ethernet interfaces via a set of various adapter cards – thus optimising the design-in and evaluation tools for the COMe-bID7.