Server-class performance with PCIe Gen4 and 100 Gbit network connectivity

Kontron is launching its first COM-HPC Server Module COMh-sdID featuring Intel’s Xeon D-2700 processors (former codename Ice Lake D). In addition, Kontron also introduces a COM-HPC Server Evaluation Carrier. The COMh-sdID with scalability from 4 to 20 cores and SKUs for an extended temperature range and 24x7/10 years reliability allows very robust implementations for harsh environments and extreme conditions in a small mechanical footprint.

The module accommodates 4x DIMM sockets for a maximum of 512 GB DDR4 memory at 3200 MT/s. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available. With 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting up to 100 Gbit Ethernet, the COMh-sdID is an ideal platform for high data throughput requirements in demanding I/O and network structures.

Delivering scalable performance complemented by Intel QuickAssist Technology and AI acceleration with Intel AVX-512, the module is highly suitable for the usage in complex AI applications, high-performance network platforms and edge servers.

“The COMh-sdID brings breakthrough performance unleashing innovations in embedded IoT for Industry 4.0. Use cases such as test and measurement, autonomous vehicles and robotics as well as numerous potential applications of AI and edge servers benefit from the new performance level on a Computer-on-Module design,” says Kontron’s Peter Müller.