An explanation of what a gas spring is, component parts, and how they are both constructed and operate. It gives the reader a basic understanding of the workings and terminology used when specifying gas springs. It offers technical recommendations and guidelines for different mounting positions on applications. It also describes the differences orientation and damping effects are to be expected dependent upon the chosen mounting position.

Master Bond’s white paper examines the challenges design engineers face as chip makers up the microprocessor power and density, and how thermally conductive adhesives can manage heat while solving other application issues